Miljkovic's work in electronic and photonic packaging recognized with ASME award

11/5/2021

Nenad MiljkovicMechSE’s Nenad Miljkovic has won the 2021 Early Career Award from the ASME Electronic and Photonic Packaging Division (EPPD). The award recognizes a young engineer with significant technical achievements in their career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.

Miljkovic, an Associate Professor and Kritzer Faculty Scholar, was selected from among accomplished contributors to the field.

His research in heat transfer, fluid mechanics, and interfacial science applies cutting-edge science and technology to address the most challenging issues in the packaging and thermal management of high-performance electronics. His group’s research intersects the multidisciplinary fields of thermo-fluid science, interfacial phenomena, and scalable nanomanufacturing with a focus on generating new knowledge and technologies focused on two-phase heat transfer (condensation, pool boiling, flow boiling, evaporation), which has the potential to enable important innovations in next-generation electronics as engineers move toward higher power density systems and approach thermal limitations.

The award was presented at the virtual InterPACK conference, held at the end of October.