L. Winston Zhang

Education

• Master of Business Administration (MBA), Marquette University, 2001
• Doctor of Philosophy (PhD) in Mechanical Engineering, University of Illinois Urbana-Champaign, 1996
• Master of Science (MS) in Mechanical Engineering, University of Alaska Fairbanks, 1991
• Bachelor of Science (BS) in Mechanical Engineering, Central-South University of Technology, Changsha, China, 1989

Academic Positions

• Adjunct Lecturer, Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, 2022-present
• Postdoctoral Research Associate, National Center for Supercomputing Applications (NCSA) and Department of Theoretical & Applied Mechanics (TAM), University of Illinois Urbana-Champaign, 1996-1997

Other Professional Employment

• President and Founder, Novark Technologies, Inc., Shenzhen, China, 2004-present
• Manager, Engineering & Technology, Thermacore Taiwan Inc., Hsinchu, Taiwan, 2002-2004
• Technical Advisor, Senior Research Engineer, and Research Engineer, Research and Development, Modine Manufacturing Company, 1997-2002

Professional Registrations

• Professional Engineer, State of Wisconsin, 1999

Selected Articles in Journals

• Xiong, K. N., Meng, L. K., Wang, S. F., and Zhang, L. W., 2022, "Experimental Investigation on Thermal Characteristics of a Novel Loop Heat Pipe for Cooling High Heat Flux Electronic Chips," International Journal of Heat and Mass Transfer, 187: 122569.
• Armas, G. S. R. B., Rouaze, G., Marcinichen, J. B., Thome, J. R. and Zhang L. W., 2021, "Air cooled loop thermosyphon cooling system for high heat load CPUs, Part II: experimental results and validation," IEEE Transaction on Components, Packaging and Manufacturing Technology, Vol. 11, No. 10: 1687-1694.
• Marcinichen, J. B., Armas, G. S. R. B., Rouaze, G., Thome, J. R. and Zhang L. W. , 2021, "Air cooled loop thermosyphon cooling system for high heat load CPUs, Part I: design and performance simulation," IEEE Transaction on Components, Packaging and Manufacturing Technology, Vol. 11, No. 10: 1679-1686.
• Lin, Z. R., Wang, S. F., Shirakashi, R., and Zhang, L. W., 2013, "Simulation of a Miniature Oscillating Heat Pipe in Bottom Heating Mode Using CFD with Unsteady Modeling," International Journal of Heat and Mass Transfer, 57: 642-656.
• Lin, Z.R., Wang S.F., Chen, J.J., Huo, J.P., Hua, Y.X., Zhang L.W., 2011, "Experimental study on effective range of miniature oscillating heat pipes," Applied Thermal Engineering, 31(5): 880-886.
• Lin, Z.R., Wang, S.F., Huo, J.P., Hua, Y.X., Chen, J.J., Zhang, L.W. and Lee, Z. Y., 2011, "Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes," Applied Thermal Engineering, 18 (6): 527-536.
• Lyman, A. C., Stephan, R. A., Thole, K. A., Zhang, L. W. and Memory, S. B., 2002, "Scaling of Heat Transfer Coefficients Along Louvered Fins," Experimental Thermal and Fluid Science 26, pp. 547-563.
• DeJong, N. C., Zhang, L. W., Jacobi, A. M., Balachandar, S. and Tafti, D. K., 1998, "A Complementary Experimental and Numerical Study of Flow and Heat Transfer in Offset Strip-Fin Heat Exchangers," Journal of Heat Transfer (Transaction of ASME), Vol. 120, pp. 690-698.
• Zhang, L. W., Balachandar, S. and Tafti, D. K., 1997, "Effects of Intrinsic Three-Dimensionality on Heat Transfer and Friction Loss in a Periodic Array of Parallel Plates," Numerical Heat Transfer, Part A, Vol. 31, pp. 327-353.
• Zhang, L. W., Balachandar, S., Tafti, D. K. and Najjar, F. M., 1997, "Heat Transfer Enhancement Mechanisms in Inline and Staggered Parallel-Plate Fin Heat Exchangers," International Journal of Heat and Mass Transfer, Vol. 40, No. 10, pp. 2307-2325.
• Zhang, L. W., Tafti, D. K., Najjar, F. M. and Balachandar, S., 1997, "Computations of Flow and Heat Transfer in Parallel-Plate Fin Heat Exchangers on the CM-5; Effects of Flow Unsteadiness and Three-Dimensionality," International Journal of Heat and Mass Transfer, Vol. 40, No. 6, pp. 1325-1341.
• Hu, X., Zhang, L. and Jacobi, A. M., 1994, "Surface Irregularity Effects of Droplets and Retained Condensate on Local Heat Transfer to Finned Tubes in Cross-Flow," ASHRAE Transaction, vol. 100(1), pp. 375-381.

Refereed Conference Papers and Presentations

• Belosludtsev, V., Garimella, V. S., Chen, Y. Y., Warden, C., Paul, A. J. A., Smith, K. C., Zhang, L. W., and Miljkovic, N., 2024, "Optimized Single-Phase Cooling of Multi-Chip Modules," presented at ASME InterPACK, October 8-10, San Jose, CA.
• Minazzo, E. M., Rouaze, G., Marcinichen, J. B., Thome, J. R., Xiong, K. N., Zhang, L. W., and Pohl, W., 2023, "Thermal Testing of Arrays of PHP Finned Plates for Enhanced Air-Cooling of Electronicss," presented at IEEE ITherm 2023.
• Minazzo, E. M., Rouaze, G., Marcinichen, J. B., Thome, J. R., and Zhang, L. W., 2022, "Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors," Proceedings of the ASME InterPACK, October 25-27, Garden Grove, CA.
• Shaw, L. H. Saw, Tay, A. A. O., and Zhang, L. W., 2013, "Thermal Management of Lithium-Ion Battery Pack with Liquid Cooling," 31st IEEE Semi-Therm Symposium, March 15-20, San Jose, CA.
• Lin, Z.R., Lee, Z.Y., Zhang, L. W. , Wang, S.F., Merrikh, A. A., Refai-Ahmed, G., 2011, "An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes with Rectangular Shaped Evaporator,"Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, InterPACK2011,2:19-27.
• Lin, Z.R., Lee, Z.Y., Zhang, L.W., Wang, S.F., Merrikh, A.A. , Refai-Ahmed, G., 2011, "Heat transfer characteristics of aluminum plate pulsating heat pipes," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, InterPACK2011, 2:29-35.
• Springer, M., Thole, K. A., Zhang, L. W., Memory, S. B. and Wattelet, J. P., 1998, "A Combined Experimental and Computational Study of Flowfields in Louvered Fin Heat Exchangers," Proceedings of ASME FEDSM'98, Paper Number FEDSM98-4843, also presented at the session on CFD Applications in Automotive Flows in 1998 ASME Summer Fluids Engineering Meeting, June 21-25, Washington, D.C.

Other Outside Service

• Track Co-Chair, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), 2017-present
• Board Member, Taiwan Thermal Management Association (TTMA), 2016-present
• Asia Liaison and Steering Committee Member, Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), 2013-present
• Board Member (2012-2020) and Chair (2017-2020), American International School of Guangzhou, Guangzhou, China

Honors

• Modine Manufacturing Company Awards for Engineering Expertise and Innovative Technical Achievements (1998-2001)
• Fellow, American Society of Mechanical Engineers (ASME) (2017)

Teaching Honors

• List of Teachers Ranked as Excellent (ME 598, Applied Heat Transfer), University of Illinois Urbana-Champaign (Spring 2023, Spring 2024)